Call for Papers: IEEE BigComp 2018

2018年IEEE大数据与智能计算国际会议

2018 IEEE International Conference on

Big Data and Smart Computing(IEEE BigComp 2018)

January 15-17, 2018, Shanghai, China

Website: http://www.bigcomputing.org/

Copyright © Shanghai Municipal Tourism Administration

Big data and smart computing are emerging research fields that have recently drawn much attention from computer science and information technology as well as from social sciences and other disciplines.The goal of the IEEE International Conference on Big Data and Smart Computing (BigComp), initiated by KIISE (Korean Institute of Information Scientists and Engineers), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in these emerging fields.Following the successes of the previous BigComp conferences in Bangkok, Thailand (2014), Jeju, Korea (2015), Hong Kong, China (2016), Jeju, Korea (2017), the 2018 IEEE International Conference on Big Data and Smart Computing (IEEE BigComp 2018) will be held in January 15-17, 2018, Shanghai, China.The conference is co-sponsored by IEEE and KIISE. IEEE BigComp 2018 invites authors to submit original research papers and original work-in-progress reports on big data and smart computing.

Important Dates

• Workshop proposal submission due:June 30, 2017

• Full paper submission due:July 31, 2017

• Tutorial proposal submission due:August 30, 2017

• Acceptance notification:October 30, 2017

• Camera-ready copies due:November 15, 2017

• Author registration due:November 20, 2017

• Early registration due:December 15, 2017

• Conference dates:January 15-17, 2018

Submission

Papers must be formatted in PDF according to the IEEE two-column format for conferenceproceedings and submitted through CMT. The direct link for paper submission is

https://cmt3.research.microsoft.com/BC2018/.

Papers can be either regular or short papers, where regular papers are limited to 8 pagesand short ones to 4 pages. Details about the submission process including formattinginstructions are at the conference website. All conference and workshop papers will bepublished in the IEEE Xplore Digital Library as conference proceedings.

Journal Publication

Selected papers will be invited for publication in the following SCIE journals after furtherrevision and extension.

• World Wide Web (SCIE)

• Peer-to-Peer Networking and Applications (SCIE)

• Frontiers of Computer Science (SCIE)

• Frontiers of Information Technology & Electronic Engineering (SCIE)

• Chinese Journal of Electronics (SCIE)

Best Paper Awards

Best Paper Awards will be conferred at the conference to the authors of selected outstandingpapers.

Topic Areas

The topics of interest for BigComp2018 include (but are not limited to) the following:

• Techniques, models and algorithms for big data

• Machine learning and AI for big data

• Web search and information retrieval

• Models and tools for smart computing

• Cloud and grid computing for big data

• Security and privacy for big data

• Smart devices and hardware

• Big data applications: Bioinformatics, Multimedia, Smartphones, etc.

• Tools and systems for big data

• Data mining, graph mining and data science

• Infrastructure and platform for smart computing

• Big data analytics and social media

• Hardware/software infrastructure for big data

• Mobile communications and networks

• Smart location-based services

Conference Organization:

General Co-Chairs

• X. Sean Wang, Fudan University, China

• Ho-Jin Choi, KAIST, Korea

Program Co-Chairs

• Junping Du, Beijing University of Posts and

Telecommunication, China

• Yasushi Sakurai, Kumamoto University, Japan

• Sourav S. Bhowmick, Nanyang Technological

University, Singapore

• SungJu Lee, KAIST, Korea

Publication Co-Chairs

• Bin Cui, Peking University, China

• Jiming Chen, Zhejiang University, China

• Wookey Lee, Inha University, Korea

Publicity Co-Chairs

• Wenling Li, Beihang University, China

• Haisheng Li, Beijing Technology and BusinessUniversity, China

• Hyukjoon Lee, Kwangwoon University, Korea

• Soon Ae Chun, CUNY-College of Staten Island, USA

Tutorial Co-Chairs

• Enhong Chen, University of Science and Technology ofChina, China

• Hui Xiong, Rutgers University, USA

• Young-Guk Ha, Konkuk University, Korea

Workshop Co-Chairs

• Yang Gao, Nanjing University, China

• Feifei Li, University of Utah, USA

• Jee-Hyong Lee, Sungkyunkwan University, Korea

Finance Co-Chairs

• Jinho Kim, Kangwon National University, Korea

• Jingnan Xu, Fudan University, China

Local Arrangement Chair

• Zhenying He, Fudan University, China

Registration Chair

• Yong-Ik Yoon, Sookmyung Women’s University, Korea

Web Co-Chairs

• Yanghua Xiao, Fudan University, China

• Chulyun Kim, Sookmyung Women’s University, Korea

Steering Committee Liaison

• Tok Wang Ling, National University of Singapore, Singapore

Steering Committee

• Kyu-Young Whang, DGIST/KAIST, Korea (Chair)

• Tok Wang Ling, National University of Singapore, Singapore

(Vice Chair)

• Chong-Kwon Kim, Seoul National University, Korea

(Secretary)

• Kang G. Shin, University of Michigan, USA (Adviser)

• Jiawei Han, University of Illinois at Urbana-Champaign, USA

• Il-Yeol Song, Drexel University, USA

• Jee-In Kim, Konkuk University, Korea

• ChoongSeon Hong, Kyung Hee University, Korea

• Bong-Hee Hong, Pusan National University, Korea